Bulk Etching Device "BEM-301"
It can be easily used by anyone simply by specifying the etching amount (depth) and the material of the wafer.
The "BEM-301" is a device that uses ozone and vaporized fluorine for etching. Etching is performed while monitoring the etching amount, allowing for high-precision etching. Additionally, accurate etching can be achieved even from the first piece. 【Specifications】 ■ Etching rate: 2μm/H or more ■ Flatness: within 10% ■ Accuracy of etching amount (depth): within ±5% ■ Utilities: O2, N2, HF, DIW, cooling water, AC-100V, AC-200V, acid exhaust, acid wastewater ■ External dimensions: 1,000W × 1,300D × 2,000H (mm) ■ Weight: approximately 300Kg *For more details, please download the PDF or contact us.
- Company：NAS技研
- Price：Other
